Manual Grundig Satellit 700 (page 7 of 40) (English, German, French, Italian, Spanish)

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Fig. 3

Fig. 4

Fig. 5

Fixierpunkt

Fixing point

Punto di fissaggio

Point de soudure

Punto de fijación

Lötzinn

Solder

Stagno

Soudure

Estaño

2. Lötstelle

2. Joint

Punto di saldatura 2

2. point de soudure

Segunda punto de soldadura

1. Lötstelle

1. Joint

Punto di saldatura 1

1. point de soudure

Primer punto de soldadura

Técnica de CHIP´s

Soldaje y desoldaje de CHIP´s

- Emplear sólo un soldador de bajo voltaje con regulación de

temperatura.

- La temperatura del soldador debe ser de aprox. 240 °C

(máx. 300 °C).

- El tiempo de soldadura debe de ser lo más corto posible.

- Dejar los componentes CHIP hasta su montaje en el embalaje

original. Con ello se evita la oxidación de los contactos frontales.

- No tocar con las manos los componentes CHIP.

Desoldaje de un CHIP

Primer paso: Aspirar el estaño del punto de soldadura con un

aspirador de los tipos de pera o de resorte (Fig. 1).

Segundo paso: Calentar los extremos o todo el CHIP y girarlo con las

pinzas. No hacer fuerza para que la placa de circuito

impreso no resulte dañada. Cuidar de que las pistas

situadas debajo del CHIP no se suelten de la placa, ya

que éstas también están pegadas (Fig. 2).

Ciudado!

No volver a utilizar el CHIP desoldado. La capa eléctrica puede

estar interrumpida.

Soldadura de CHIP´s

Tercer paso: Limpiar el punto de soldadura de residuos de la

soldadura anterior. Poner una gota de estaño (Fig. 3).

Cuarto paso: Colocar el CHIP sobre la gota estaño, centrarlo y

soldarlo (Fig. 4).

Quinto paso: Soldar la parte libre y, después enfriarse, soldar

también la parte opuesta (Fig. 5).

Handling of MOS Chip Components

MOS circuits require special attention with regard to static charges.

Static charges may occur with any highly insulating plastics and can be

transferred to persons wearing clothes and shoes made of synthetic

materials.

Protective circuits on the inputs and outputs of MOS circuits give

protection to a limited extent only due to the time of reaction.

Please observe the following instructions to protect the components

against damages from static charges:

1. Keep MOS components in conductive packages until they are

used. MOS components must never be stored or transported in

Styropor materials or plastic magazines.

2. Persons have to rid themselves of electrostatic charges by

touching a grounded object before handling MOS components.

3. Take the chip by the body without touching the terminals.

4. Use only grounded instruments for testing and processing

purposes.

5. Remove or connect MOS ICs with in mounting sockets only if the

operating voltage is disconnected.

6. The circuits of p-channel MOS components must not be

connected to positive voltages (with reference to bulk VSS).

MOS Soldering Instructions

• Use only mains isolated low-voltage soldering irons.

• Maximum soldering period 5 seconds at a soldering iron tempe-

rature of 300 to 400 degrees Celsius.

Behandlung von MOS - Bauelementen

Schaltungen in MOS-Technik bedürfen besonderer Vorsichtsmaß-

nahmen gegenüber statischer Aufladung. Statische Aufladungen kön-

nen an allen hochisolierenden Kunststoffen auftreten und auf den

Menschen übertragen werden, wenn Kleidung und Schuhe aus syn-

thetischem Material bestehen.

Schutzstrukturen an den Ein- und Ausgängen der MOS-Schaltungen

geben wegen ihrer Ansprechzeit nur begrenzte Sicherheit.

Bitte beachten Sie folgende Regeln, um Bauelemente vor Beschädi-

gung durch statische Aufladungen zu schützen:

1. MOS-Schaltungen sollen bis zur Verarbeitung in elektrisch leiten-

den Verpackungen verbleiben. Keinesfalls MOS-Bauteile in Styro-

por oder Plastikschienen lagern oder transportieren.

2. Personen müssen sich durch Berühren eines geerdeten Gegen-

standes entladen, bevor sie MOS-Bauteile anfassen.

3. MOS-Bauelemente nur am Gehäuse anfassen, ohne die Anschlüs-

se zu berühren.

4. Prüfung und Bearbeitung nur an geerdeten Geräten vornehmen.

5. Lösen oder kontaktieren Sie MOS-ICs in Steckfassungen nicht

unter Betriebsspannung.

6. Bei p-Kanal-MOS-Bauelementen dürfen keine positiven Span-

nungen (bezogen auf den Substratanschluß VSS) an die Schaltung

gelangen.

Lötvorschriften für MOS-Schaltungen:

• Nur netzgetrennte Niedervoltlötkolben verwenden.

• Maximale Lötzeit 5 Sekunden bei einer Lötkolbentemperatur von

300 °C

bis 400 °C.

Satellit 700 Allgemeine Hinweise / General Notes

GRUNDIG Service-Technik

hello, is that the service manual or the user manual ? thanks. Submitted on 16-3-2023 at 19:01
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Grundig Satellit 700 Manual

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