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Grundig Satellit 700 Manual

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Pinzette
Tweezers
Pinzetta
Pince brucelle
Pinzas
Lötkolbenspitze
Tip of soldering iron
Punta saldatore
Panne du fer à souder
Punto de soldator
D
CHIP Technik
Aus- und Einlöten von CHIP-Bauteilen
- Verwenden Sie nur einen Niedervoltlötkolben mit Temperatur-
regelung.
- Die Löttemperatur sollte ca. 240 °C betragen (max. 300 °C).
- Halten Sie die Lötzeit so kurz wie möglich.
- Belassen Sie CHIP-Bauteile bis zur Bearbeitung in der Originalver-
packung. Damit wird die Oxidation der Stirnkontakte vermieden.
- Berühren Sie CHIP- Bauteile nicht mit der bloßen Hand.
Auslöten von CHIP-Bauteilen
1. Schritt: CHIP- Lötstelle mit Sauglitze absaugen (Fig. 1).
2. Schritt: CHIP-Enden, bzw. das komplette CHIP-Bauteil erwärmen.
CHIP von der Klebung ohne Kraftaufwand abdrehen, damit
unter dem CHIP liegende Leiterbahnen nicht abgerissen
werden (Fig. 2).
Achtung!
Ausgelötetes CHIP nicht wiederverwenden!
Die leitende Schicht kann ausgebrochen sein.
Einlöten von CHIP-Bauteilen
3.Schritt: Lötpunkt von Lötrückständen säubern.
Lötperle anbringen (Fig. 3).
4. Schritt: CHIP an der Lötstelle ansetzen, zentrieren und anlöten
(Fig. 4).
5.Schritt: Freie Seite löten. Nach dem Erkalten die erste Lötstelle
nochmals nachlöten (Fig. 5).
I
Tecnica CHIP
Saldatura e dissaldatura di componenti MOS
- Impiegare un saldatore a basso voltaggio con regolazione della
temperatura.
- Temperatura del saldatore: ca. 240 °C (valore massimo 300 °C).
- Il tempo di saldatura deve essere il più breve possibile.
- Il componente CHIP deve rimanere nell´imballaggio originale fino al
momento del suo impiego per evitare che le superfici di contatto si
ossidino.
- Non toccare i componenti CHIP con mani nude.
Dissaldatura di un CHIP
1. Aspirare i punti di saldatura del CHIP con una calza dissaldante
(Fig. 1).
2. Riscaldare le superfici di contatto del CHIP risp. te tutto il CHIP e
staccarlo con cautela. Attenzione a non esercitare for za per non
danneggiare le piste sottostanti (Fig. 2).
Attenzione!
Non impiegare più il CHIP dissaldato, perchè il corpo elettrico
può presentare delle rotture.
Saldatura di un CHIP
3. Pulire il punto dai residui di saldatura. Applicare una goccia di stagno
(Fig. 3).
4. Appoggiare il CHIP sul punto di saldatura, centrarlo e quindi saldarlo
(Fig. 4).
5. Saldare la superfici di contatto libera e, dopo che questa si è
raffreddata, saldare nuovamente la superfici opposta (Fig. 5).
GB
CHIP Technology
Soldering and unsoldering of CHIP components
- Use only low-voltage soldering irons with temperature control.
- Permissible soldering temperatures are approx. 240 °C up to
max. 300 °C.
- Keep the soldering period as short as possible.
- Keep the CHIP components in their original packages until they
are used to avoid oxidation of the end contacts.
- Do not touch CHIP components with bare hands.
Unsoldering of CHIP components
1. step: Clean the CHIP soldering point with a solder wick (Fig. 1).
2. step: Warm up the ends of the CHIP or the whole CHIP component
and remove the CHIP from the adhesive by turning it without
application of force so that the tracks beneath the CHIP do not
break (Fig. 2).
Attention!
Do not use unsoldered CHIPS any more!
The conductive layer may be broken.
Soldering of CHIP components
3. step: Remove possible residues from the soldering point.
Then apply a solder bead (Fig. 3).
4. step: Put the CHIP onto the soldering point, then center and fix it
(Fig. 4).
5. step: Solder the free end of the CHIP and resolder the first
soldering point after it has cooled (Fig. 5).
F
Technologie CMS
Soudure des composants CMS
- Utiliser exclusivement un fer à souder à basse tension et réglage
thermique
- La température de soudure doit être de 240 °C environ (max.
300 °C).
- L´opération doit être très brève.
- Conserver les composants CMS dans leur emballage d´origine
jusqu´au moment de leur utilisation, ceci pour éviter l´oxydation
des contacts externes.
- Ne pas toucher les composants CMS à la main nue.
Dessoudage des composants CMS
1. Aspirer la soudure du composant CMS à la l´aide de la tresse à
souder (Fig. 1).
2. Chauffer légèrement les contacts externes du composant CMS ou
le composant lui-même. Retirer ce dernier avec précaution en le
tournant afin d´évìter un arrachement des circuits imprimés situés
sous le composant (Fig. 2).
Attention!
Ne pas réutiliser les composants CMS, la face conductrice
pouvant être endomagée.
Soudure des composants CMS
3. Aspirer les restes de soudure sur le circuit. Poser une pointe de
soudure (Fig. 3).
4. Poser le composant CMS sur cette pointe de soudure, centrer et
souder. Maintenir le composant CMS à l´aide d´une pince brucelle
(Fig. 4).
5. Effectuer la même opération pour l´autre coté. Terminer la première
soudure (Fig. 5).
Kleber
Adhesive
Adesivo
Adhesif
Pegamento
Lötzinn
Solder
Stagno
Soudure
Estaño
Chip
Composant CMS
Lötkolbenspitze
Tip of soldering iron
Punta saldatore
Panne du fer à souder
Punto de soldator
Fig. 2
Leiterplatte
P.C.B.
Piastra stampata
Circuit imprimé
Placa de circuito impreso
Fig. 1
Allgemeine Hinweise / General Notes
Satellit 700
6 GRUNDIG Service-Technik
… 6 …


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  • hello, is that the service manual or the user manual ? thanks. Submitted on 16-3-2023 at 19:01

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